天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
地址：深圳市宝安区福永镇重庆路科比新工业园 3楼 邮编：518010
Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
Shen Zhen, China
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RoHS最新豁免清单
[Those parts of this Annex highlighted in grey are amendments and
additions
to the original Annex to the RoHS Directive made by two Commission
Decisions published in the Official Journal in October 20056. The
RoHS
Regulations will be amended to reflect these changes in due course.]
Guidance on the specific applications of lead, mercury, cadmium,
hexavalent
chromium, PBB and PBDE set out in Schedule 2 of the RoHS
Regulations that
are exempt from its requirements: -
1. Mercury in compact fluorescent lamps not exceeding 5 mg per
lamp.
A compact fluorescent lamp (CFL) is usually defined as a single-ended
fluorescent lamp with a bent discharge tube of small diameter, of around
10-16
mm, to form a very compact unit. These lamps can be either integral,
whereby
the lamp and ballast are combined (also known as self-ballasted or
selfsupporting),
or pin-based.
For the purpose of this exemption, CFLs can contain no more than 5 mg of
mercury per lamp.
2. Mercury in straight fluorescent lamps for general purposes not
exceeding:
- 10 mg in halophosphate lamps
- 5 mg in triphosphate lamps with a normal lifetime
- 8 mg in triphosphate lamps with a long lifetime.
A straight, or linear, fluorescent lamp is a fluorescent lamp of straight
tubular form
and bi-pin electrical connections at either end.
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The colour properties of straight fluorescent lamps are determined by the
phosphors used to coat the inside of the tube. Halophospate and
triphospate are
examples of such fluorescent materials.
Straight fluorescent lamps for general purpose can be defined as lamps
used for
general lighting solutions, in contrast to lamps used for special purposes
(see
item 3 below).
3. Mercury in straight fluorescent lamps for special purposes.
Examples of such lamps are LCD back light lamps, disinfection lamps,
medical/therapy lamps, pet care lamps (. aquaria lamps), lamps with
special
components (. integrated reflectors or external protection sleeves),
lamps with
special ignition features (. designed for low temperatures), long length
lamps
(length > 1800mm) and amalgam lamps.
In this context, there is no restriction on the quantity of mercury in these
lamps.
6 Commission Decision 2005/717/EC of 13 October 2005, (OJ No. L271,
, )
and Commission Decision 2005/747/EC of 21 October 2005, (OJ No. L280,
, )
4. Mercury in other lamps not specifically mentioned in this Annex.
Examples of other lamps containing mercury are high intensity discharge
(HID)
lamps (. sodium lamps and metal halide lamps), circular fluorescent
lamps
and U-shaped fluorescent lamps.
In this context, there is no restriction on the quantity of mercury in these
lamps.
5. Lead in glass of cathode ray tubes, electronic components and
fluorescent
tubes.
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Lead, or more specifically lead oxide, is often used in glass for electrical
and
electronic equipment to obtain specific characteristics, such as radiation
protection (CRTs, medical applications), filtering (photography, image
processing) and strengthening purposes (. production of fluorescent
tubes).
This exemption has been introduced because viable alternatives for these
applications have not yet been identified.
For clarity, the exemption applies to lead as a constituent in the glass used
in
cathode ray tubes, lead as a constituent in the glass used in electronic
components and lead as a constituent in the glass used in fluorescent
tubes.
6. Lead as an alloying element in steel containing up to % lead by
weight,
aluminium containing up to % lead by weight and as a copper alloy
containing up to 4% lead by weight.
Lead is often used as an alloying element to obtain specific properties of a
metal
alloy. This exemption applies to the use of lead in steel up to % by
weight, in
aluminium up to % by weight and in copper alloys up to 4% by weight. In
the
context of this exemption, ‘percentage by weight’ has to be interpreted as
‘the
percentage of lead per homogeneous material per discreet part’. For
example, if
the steel housing of a computer consists of two separate parts, each part
can
contain up to % lead by weight of that part.
7. Lead in high melting temperature type solders (. lead based
alloys
containing 85% by weight or more lead).
For the purposes of applications 7, 8 and 9 in this Annex, it is useful to
clarify the
term ‘solder’. In these Guidance Notes, ‘solder’ is defined as “alloys used to
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create metallurgical bonds between two or more metal surfaces to achieve
an
electrical and/or physical connection”. In this context, the term ‘solder’ also
includes all materials that become part of the final solder joint, including
solder
finishes on components or printed circuit boards.
The high melting temperature type solder exemption has been introduced to
allow the use of lead in solders for specific applications (such as in power
semiconductor package manufacturing), for which viable lead-free
alternatives
have not yet been identified. This exemption is permitted as there are no
alternative alloys with similar melting point and which are ductile. The high
electrical conductivity and unique mechanical properties of such a high
melting
point tin-lead alloy make the material malleable and better able to withstand
both
temperature and physical stress. Such properties ensure fewer defects
during
manufacturing and high reliability throughout the life of the component,
thereby
also resulting in fewer components going into the waste stream.
8. Lead in solders for servers, storage and storage array systems,
network
infrastructure equipment for switching, signaling, transmission as
well as
network management for telecommunication.
See definition of ‘solder’ given for application 7 above.
This exemption has been introduced to allow the use of lead in solders for
professional, high reliability applications, such as servers and network
infrastructure equipment, for which viable lead-free alternatives have not
yet been
identified.
In this context, a ‘server’ is seen as a computer that meets one of the
technology
criteria that are set out in section (a) below, and the functional criteria set
out in
section (b) below.
天瑞仪器有限责任公司
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(a) Technology criteria for a server
1) Designed and placed on the market as a Class A product as per
EN55022:1994 under the EMC Directive 89/336/EEC (intended primarily for
use in the professional environment) and designed and capable of having a
single or dual processor capability (one or more sockets on board); or
2) Designed and placed on the market as a Class B product (intended
primarily
for use in the domestic environment) as per EN55022:1994 under the EMC
Directive 89/336/EEC and designed and capable of having at least dual
processor capability (two sockets on board).
(b) Functional design criteria for a server
1) Designed and capable of operating in a mission-critical, high-reliability,
highavailability
application in which use may be 24 hours per day and 7 days per
week, and unscheduled downtime is extremely low (minutes per year).
Examples of typical server functions are the provision of network
infrastructure, gateway or switching services, the hosting and management
of
data on behalf of multiple users, or the running of server-capable operating
systems (. as for a web server).
It is the Department’s view that this exemption is viewed as applying to the
whole
of the computer and its components including processors, memory boards,
power
converters, power supplies, enclosed housings, modular power subsystems
and
adapter cards. It would also seem to apply to the components that are
integrated
into the whole computer or that are sold separately for use in an exempt
server.
Cables and cable assemblies, and all connectors and connector
assemblies used
to provide interconnections for the server, would also be covered by this
exemption.
It should be noted that this exemption is not viewed as applying to parts or
components that are peripheral to the server, nor does it apply to parts or
components when they are used other than in an exempt server.
For the purpose of the RoHS Regulations, a ‘storage or storage array
天瑞仪器有限责任公司
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system’
is viewed as any storage device or subsystem that meets one of the
following
criteria:
1) Designed and placed on the market as a Class A product as per
EN55022:1994 under the EMC Directive 89/336/EEC; or
19
2) Designed and placed on the market as a Class B product as per
EN55022:1994 under the EMC Directive 89/336/EEC and designed to meet
one of the following two criteria: -
a) Any storage device capable of accepting direct or switched input from
more than one computer, for example fibre channel and SCSI devices,
or
b) Any storage fabric or switching device for interconnecting storage
devices to server products.
It is the Department’s view that this exemption is viewed as applying to the
whole
of the device or subsystem and their components including processors,
memory
boards, power converters, power supplies, enclosed housings, modular
power
subsystems and adapter cards. It would also seem to apply to the
components
that are integrated into the whole storage or storage array system or that
are sold
separately for use in an exempt storage or storage array system. Cables
and
cable assemblies, and all connectors and connector assemblies used to
provide
interconnections for the storage or storage array system, would also be
covered
by this exemption.
It should be noted that this exemption does not apply to parts or
components that
are peripheral to the storage or storage array system, nor does it apply to
parts or
components when they are used other than in an exempt storage or storage
array system.
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
地址：深圳市宝安区福永镇重庆路科比新工业园 3楼 邮编：518010
Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
Shen Zhen, China
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For the purpose of the RoHS Regulations, ‘network infrastructure
equipment
for telecommunication purposes’ is viewed by the Department as
equipment
meeting one of the two following criteria:
1) Any system used for routing, switching, signalling, transmission, or
network
management or network security; or
2) Any system which can simultaneously enable more than one end user
terminating equipment to connect to a network.
It is also any such system in a network, except for end user terminating
equipment such as voice terminals and facsimile machines.
This would include all servers, power suppliers, display devices and similar
electronic units that are incorporated into network infrastructure equipment.
It
would also include all cables and cable assemblies, and all connectors and
connector assemblies used to provide interconnections for network
infrastructure
equipment but is not intended to include desktop or notebook computers,
telephones, fax machines or consumer – type modems or switches etc.
9. Lead in electronic ceramic parts (. piezoelectronic devices).
Ceramic materials are used in a variety of electronic devices including
capacitors,
insulators, piezoelectrics, magnets and integrated circuit packages. Some
of
these ceramic materials contain lead, for example lead zirconate titanate
and
lead magnesium niobate. The specific chemical composition and
manufacturing
process of these materials determine their electrical parameters, such as
dielectric constant and the dissipation, that is essential for the functioning of
the
component in which they are used. Hence, lead used in the ceramic parts of
electronic components in electrical and electronic equipment is exempt
from
these Regulations.
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
地址：深圳市宝安区福永镇重庆路科比新工业园 3楼 邮编：518010
Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
Shen Zhen, China
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10. Cadmium and its compounds in electrical contacts and cadmium
plating
except for applications banned under Directive 91/338/EEC (OJ No. L
186,
12 July 1991, p. 59) amending Directive 76/769/EEC (OJ No. L262, 27
September 1976, p. 201) relating to restrictions on the marketing and
use of
certain dangerous substances and preparations.
Directive 91/338/EEC amending Directive 76/769/EEC relating to
restrictions on
the marketing and use of certain dangerous substances and preparations,
gives
the following definition of cadmium plating: “Within the meaning of this
Directive,
‘cadmium plating’ means any deposit or coating of metallic cadmium on a
metallic
surface.” This definition is seen as applying for the purpose of the RoHS
Regulations.
Subsequently, the Marketing and Use Directive (as amended) bans the use
of
cadmium plating in a variety of product sectors. However, that Directive
allows
the use of cadmium plating for “electrical contacts in any sector of use, on
account of the reliability required of the apparatus on which they are
installed.”
As a result, in this context cadmium plating is prohibited for products
manufactured in the household goods and central heating and air
conditioning
plant sectors. However, it is viewed as being permitted for electrical
contacts in all
the WEEE categories to which the RoHS Regulations apply.
11. Hexavalent chromium as an anti-corrosion of the carbon steel
cooling
system in absorption refrigerators.
As absorption cooling works on several different types of energy sources
such as
gas, kerosene, batteries or electricity, absorption fridges are often used in
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
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recreational vehicles (. motor homes and caravans) or remote places
where
electricity is not available. Another typical application is for minibars in hotel
rooms as these fridges are virtually noiseless.
The applied heat and use of a water-ammonia mixture results in a corrosive
environment that warrants the use of hexavalent chromium. This exemption
has
been introduced, since viable alternatives for this specific application have
so far
not been identified.
12. Deca BDE in polymeric applications
Deca Brominated Diphenyl Ether (Deca BDE) is a commercial substance
used as
a flame retardant in a wide range of polymeric applications including
plastics,
rubbers, elastomers, coatings, adhesives and sealants. This substance has
been
subject to a 10-year risk assessment at EU level (under Council Regulation
(EEC) No 793/93 of 23 March 1993 on the evaluation and control of the
risks of
existing substances), which has concluded that there is at present no need
for
additional measures to reduce the risks beyond those that are being applied
already. As a result, applications of the commercial Deca BDE substance in
electrical and electronic equipment have been exempted from the
requirements
of the RoHS Directive and the RoHS Regulations.
13. Lead in lead-bronze bearing shells and bushes
Lead-bronze bearing shells and bushes are used, amongst others, in
compressors for stationary refrigeration and air conditioning equipment.
Typical
characteristics of such compressors include a long design life (over
hours
for residential applications and over for commercial applications)
and an
hermetic sealing to prevent refrigerant leakage and ensure reliable,
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
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Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
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uninterrupted
operation without service for up to 15 years. Combined with the unique
technical
aspects of the refrigeration cycle (dry-starts, miscibility of the lubricant,
repeated
condensing and boiling, etc.), the bearings need excellent self-lubrication
properties to meet the high durability and reliability requirements. Due to its
lubricious nature, the use of lead as a bearing constituent is critical in these
applications. This exemption has been introduced because so far no
suitable
alternative has been identified, although other materials have been
extensively
tested.
14. Lead used in compliant pin connector systems.
Compliant pin contacts are used to attach connectors or components to a
doublesided
printed circuit board. This connector system avoids the need for soldering
during manufacturing, thereby avoiding the overheating of components and
damaging the integrity of the connectors and board material and allows
separation for repair. Such pins are coated with a tin-lead alloy to ensure
good
electrical conductivity, maintain sufficient spring-back force and facilitate
insertion
of the pins into the boards. The use of tin-lead also reduces the risk of tin
whiskers, which may affect reliability.
This exemption has been introduced because suitable alternatives to the
tin-lead
alloy have not yet been identified.
15. Lead as a coating material for the thermal conduction module
c-ring.
A thermal conduction module c-ring serves a specific purpose in the
manufacturing of high performance electronic modules. Such modules are
the
key components of a mainframe central processing unit and typically
contain
multiple chips. The c-ring functions as a hermetical seal, continuously
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
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Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
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dissipating
heat and preventing oxidation of solder joints.
While substitutes for lead in this application have been investigated, no
feasible
alternative has so far been identified.
16. Lead and cadmium in optical and filter glass.
Lead and cadmium are used in optical glass and filter glass to obtain
specific properties and meet quality standards, for a wide variety of
applications
including in the photo industry (. camera lenses), in projectors, scanners,
printers and copiers.
This exemption has been introduced because suitable alternatives for many
of
these applications have not yet been identified.
17. Lead in solders consisting of more than two elements for the
connection
between the pins and the package of microprocessors with a lead
content
of more than 80% and less than 85% by weight.
Microprocessors are mounted onto boards or substrates by way of a
socket.
Such sockets require that a large number of pins (up to 950) are mounted
onto
the microprocessor for completing the necessary electrical connections.
The
high customer quality demands for these products mean that such
packages are
extensively tested, which necessitates high adhesion strength of the pins.
This is
even more critical at higher pin counts and the application of lead in the
proportions specified in this exemption is essential to achieve the necessary
properties.
Substitute materials without lead are used by some manufacturers but for
high
pin counts, the development of alternatives before 1 July 2006 would create
significant quantities of waste. This exemption has been introduced to allow
天瑞仪器有限责任公司
Skyray Ins t rument Co. , Ltd .
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Addr：Floor 3(rd),Block D, Keepon Industry Zone, Chongqing Rd., Fuyong, Bao’an District,
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for
the development of alternative designs without generating excessive
amounts of
waste.
18. Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated circuit Flip Chip
packages.
Flip chips are attached to their packages or PCBs using very small solder
bumps
and many types use solder bumps containing lead. Lead is used for two
main
reasons. Its ductility reduces the risk of damage to brittle parts of flip chip
circuitry. Lead also protects against the possibility of thermal fatigue, which
results from cyclic temperature changes and is not well understood with
lead-free
solders. High melting point solder bumps are attached using solder
containing
typically 37 – 40% lead to the package because this combination has a high
resistance to a phenomenon called “electromigration” which in higher power
flip
chip packages would otherwise cause premature failure of the device.
The solder connections to the chip are known as level 1 and level 1 flip-chip
connections may contain lead. The external solder connections between
packages and PCB known as level 2 are excluded from this exemption as
viable
alternatives have been developed.
