LCM Process•LCM JI Process Introduction•LCM MA Process Introduction
TFT-LCD 產業結構圖玻璃基版ITO導電玻璃光源模組光罩PCB上游材料偏光版液晶彩色濾光片驅動IC中游TN LCDSTN LCDTFT LCD面版模組面板下消費產品電腦資訊通訊產品工業產品家電產品游應液晶電視手錶筆記型電腦行動電話機器設備用VCD Player計算機液晶顯示器汽車導航醫療儀器產攜帶電視PDA掌上型電腦呼叫器交通運輸品背投電視數位相機電腦週邊視訊電話儀表設備民生家電電子字典
TFT-LCD Process Overview
LCM Production Process
TFT-LCD Cross Section
JI Process Technology•LCM JI Process Overview•JI Process Testing
LCM Process OverviewCOG ModelTAB ModelOLBCOG前(Silicone)FPC段PCBPCBJI製程PCB testPCB testSiliconeSiliconeAssemblyAssembly後Assembly testAssembly test段AgingAgingMA製Final Inspection程Final InspectionPackingPacking
LCM Terminology Summary•LCM (Liquid Crystal Display Module): 液晶顯示器模組•COG (Chip on Glass): 晶粒-玻璃接合•TAB (Tape Automated Bonding): 捲帶式晶粒接合•ACF (Anisotropic Conductive Film): 異方性導電膠•OLB (Outer Lead Bonding): 外引腳接合•ILB (Inner Lead Bonding): 內引腳接合•FPC (Flexible Print Circuit Board): 可撓性印刷電路板•PCB (Print Circuit Board): 印刷電路板
LCM JI Process FlowJI ProcessTAB ProcessPCB orPCBOLBSLDSODTestGomu/SiliconeJBOCellRubber/KittingMaskingTAB+COGTapeProcessattachUV/COG(LCT)S-FPCG-FPCCOG Process
JI Key Component & Material•Driver IC -Flip chip•Tape carrier package (TCP)•Chip on Film (COF)•PCB -Printed Circuit Board•FPC -Flexible Printed Circuit Board•ACF -Anisotropic Conductive Film
Driver IC
Driver IC
Driver IC/TCP
Driver IC/TCP Structure
PCBFPC Structure
ACF (Anisotropic Conductive Film)
ACF Function-Electrical InterconnectionInterconnection: IC/Cell;IC/PCB;FPC/PCB
JI Process Flow Overview
TAB/COG Profile
TCP & COF Structure Comparison
Cell Cleaning Clean : Photo cleaning by UV Plasma Clean : Water washing (水洗) Alkali cleaning (鹼洗) Acid cleaning (酸洗) Detergent cleaning (清潔劑) Solvent cleaning (溶劑清洗) Jet cleaning (加壓清洗)
OLB/COG Process
COG Process Flow
Adhesive Methodology
OLB Process Flow
Basic Concept of Bonding
Phenomena after Bonding
PCB Bonding Process Flow
Heating MethodologyPulse heatingShort barConstant heatingLong bar
PCB Test
Semi-Good after JI Process
Module Assembly ProcessMA Process Technology•LCM MA Production Overview•MA Process & BLU •Quality Engineering
Module Assembly Overview
Module Assembly Key Component
Structure ComparisonBy Product CharacteristicsLampLGPBackShieldingFrameStraight lamp / L-lampMonitor平板BezelBezel / Al tape(雙側燈入光)Straight lampNotebook契型PlasticMylar / AL tape(單側燈入光)Straight lamp / C-lampTVN/A (withBezelBezel直下式擴散板)Straight lamp/ C-lampAV平板PlasticMylar / AL tape側燈入光
Key Component Functional ListPartsMaterialFunctionNoteBezelSUS, Aluminum強度,保護,安裝,EMITCPPI含FPCPWBGlass EpoxyPWB CoverPET保護,絕緣P-ChassisPC支持,絕緣,遮光,反射,保護DiffuserPET擴散Len FilmPET集光3MLight GuidePMMA擴散,輝度分佈均一化ReflectorPET反射Rear AngleSUS, Aluminum強度,保護,EMI,PWB安裝,放熱Lamp CoverSUS, Aluminum強度,CCFT保護,EMILamp ReflectorPET反射Lamp HolderPC, SUS, Aluminum放熱,補強,EMICCFTGlass含Wire, ConnectorScrewTap, FilmPET, PIRubberSIR保護,絕緣,緩衝
Backlight Structure (Monitor Type)
Backlight Structure (Notebook Type)
Module Structure Profile
Module Assembly ProcessInstallation of backlightAssemblyPanel setLaminate peelingBendingAgingPeeling of the upside laminateBacklight lighting inspectionBacklight lightingPackingBezel mounting
Backlight Assembly (NB Type)
Cell & BLU Assembly (NB Type)
Cell & BLU Assembly (MN Type)
Cell & BLU Assembly (MN Type)
Final Good Profile
Aging Process (Burn-in)•壽命測試•穩定性測試
Final Display Inspection
OQC & Packing
Quality Engineering
TFT-LCD Reliability Test試驗屬性試驗名稱試驗目的應用設備一般性環境試驗高溫高濕動作驗證產品於高溫高濕環境下之使用能力恆溫恆濕槽高溫高濕保存驗證產品於高溫高濕環境下之儲存能力恆溫恆濕槽高溫動作驗證產品於高溫環境下之使用能力恆溫恆濕槽高溫保存驗證產品於高溫環境下之儲存能力恆溫恆濕槽低溫動作驗證產品於低溫環境下之使用能力恆溫恆濕槽低溫保存驗證產品於低溫環境下之儲存能力恆溫恆濕槽冷熱衝擊驗證產品於快速冷熱環境交替下之儲存能力冷熱衝擊試驗裝置高加速應力(HAST)應用高加速應力驗證產品壽命Pressure Cooker機械性環境試驗振動試驗驗證產品於運送過程中耐振動之能力振動試驗裝置機械衝擊試驗驗證產品於使用及運搬過程中耐機械衝擊之能力機械衝擊試驗裝置捆包落下試驗驗證包裝材於運搬過程中對產品保護之能力捆包落下試驗裝置局部扭轉應力試驗驗證產品於使用過程遭扭擠變形之承受能力局部扭轉應力試驗裝置面壓力試驗驗證產品於使用過程遭正面擠壓之承受能力面壓力試驗裝置SEAL強度試驗驗證Seal之機械強度,避免面板破損洩漏SEAL強度試驗裝置安全性試驗靜電放電測試(ESD)驗證產品遭環境靜電破壞之承受能力靜電放電測試裝置絕緣耐壓測試驗證產品高壓絕緣特性絕緣耐壓測試裝置
Reliability Study•產品壽命週期故障率曲線--浴缸曲線浴缸曲線(Bath-tub)之探討DFR : Decreasing failure rate ----ESS 之研究應用CFR : Constant failure rate ----MTBF,MTTF 之研究應用IFR : Increasing failure rate ----MTTR 之研究應用
