ֻ16जֻ2௹۽ြ۽ӱ 2013୍4ᄅApril2013IndustrialEngineeringJournaldoi: ໓ངѓᆽ:A ໓ᅣщݼ:1007-7375(2013)02-0001-10Service-EmbeddedManufacturingandTSMCWayforWaferFoundryServiceChienChen-fu,KuoRen-tsun(DepartmentofIndustrialEngineeringandEngineeringManagement,NationalTsingHuaUniversity,Hsinchu30013,China)Abstract:Thecharacteristicsofservice-embeddedmanufacturinginhigh-techindustryisexploredandthekeysuccessfactorsofTaiwanSemiconductorManufacturingCompany(TSMC),suchaswideanddeepmanufacturingtechnology,opendesignservice,virtualFab,service-orientedculture,andmasscustomiza-tion,-embeddedmanufacturingframework,includingtheservicevaluechainofwaferfoundry,,thedevelopingpathofdifferentwaferfoundrycompaniesiscompared,,aftercomparingdifferentrolemodelsofservice-embeddedmanufacturingindifferentindus-tries,,adoptionofvirtualintegration,insteadofverti-calintegrationforbothbrandandfoundrycompanies,:service-embeddedmanufacturing;TSMCWay;waferfoundry;manufacturingservice;virtualfab ᇅᄯြളӁაཧ൲Ӂ,ڛༀြᄵิ܂ڛༀ。ြӁᆴ֥бᇗᄀটᄀۚ,Ԯᇅᄯြ္Ֆܤग़ؓӁෛሢӁ֥Էྍࠣᄹᆴڛༀٓຶ֥ഥ,ڛༀြაླ֥࢘؇ഥ,ཟܤग़ิ܂۷؟ሸކྟ֥ڛༀ。ᇅᄯြ֥ࢸཋэ֤ଆ,ڛༀြႄ֝ᇅᄯြളӁ۷۴ऌᆃᇕӁြؿᅚ൝,စളԛ۲ᇕᇅᄯაڛༀವႪᇉ֥Ӂটડቀܤग़ླ,طᇅᄯြᄵᄎႨ۷Ⴊކ֥҂ྙ,ЇওളӁྟڛༀ(ᇅᄯᄹ఼ڛༀ)、ᇉ֥ڛༀটิശఃࣩᆚ৯。ܼၬ֥ڛༀြᅝ෮ႵఒڛༀྟളӁ(ڛༀᄹ఼ᇅᄯ、ၛڛༀູ֝ཟ֥ᇅ൬۠ರ௹:2011-04-25ࠎࣁཛଢ:ਆρౢކቔ࣮࠹߃ሧᇹཛଢ(99N2442E1);࢝ტ҆જཟפࡕն࿐פࡕ࣮ᇏྏᆜކ࠹߃ሧᇹཛଢ(100N2073E1)ቔᆀࡥࢺ:ࡥᨃڶ(1966-),ଳ,ຖസದ,࢝൱,Ѱൖ,ᇶေ࣮ٚཟູ۽ြ۽ӱ.
۽ ြ ۽ ӱֻ16ज 2ᄯ、ᇅᄯڛༀ),ၛ୍ࠣ࣍Ҍิԛ֥ڛༀᇅᄯ֩࿐ ਸ਼ຓ,Ԣਔഅြଆൔ֥Էྍຓ,ࣖჵս۽ӌഅ္ඌ࣮ބӁြؿᅚٚཟ。ӻ࿃ᄝ“ܤग़ڛༀ֥Էྍ”,ѩส֥ቆᆮ[4]ڛༀᇅᄯࠎЧഈವކਔളӁྟڛༀაڛༀྟэ۪。ࣖჵս۽აܤग़֥,֤ࣖჵս۽ӌളӁ֥หᆘ,ѩࡆೆਔग़ಆӱҕაᆃ۱ᇗေ֥ჭഅ၇ܤग़ླط҂؎ֹิശఃӁᇉ、ཙႋ؇,֤ఒြބग़ॖၛࢶႮྴࠢӮ(virtualinte-აႋэྟ,ग़ܴഈྙӮਔࡼࣖჵӌቔູग़ྴgration)ٚൔಞӁြࡎᆴ৽֥҂ٳ۽ࠄϴ۲ሱؿߨࣖჵӌ(virtualfab)֥ۀ,ᆃ֤ࣖჵս۽ሇູఃނྏࣩᆚ৯,Էᄯఒြაग़ච႓֥ࡎᆴ。ۚ؇϶ุ֝ᇅᄯڛༀ(semiconductormanufacturingserv-֥ྴࠢӮࡼॖູቋᇔܤग़ิ܂ژކః۱ྟ߄ླice,SMS),Ӯູ၂ᇕڛༀᇅᄯြ֥ׅٓ。֥ܼၬӁ(༮ၬӁ+ڛༀ),ၹՎڛༀᇅᄯ҂Ч࣮༵קၬڛༀᇅᄯြ,০Ⴈ෮ิԛ֥ٳࣇ൞Ӂᄹᆴ֥ჷಅ,ൈ္ၹپڶਔڛༀ֥ଽݤ༅ࡏܒ,ౢڛༀᇅᄯြ֥ऎุଽݤ,ѩၛਵ֝ӌطᄹࡆӁაఒြ֥Էྍหྟ。അTSMCູ২ฐษࣖჵս۽ြሇູ϶ุ֝ᇅᄯڛᄪ௹֥϶ุ֝ఒြ൞ԼᆰࠢӮਔՖഡ࠹、ᇅༀြ֥ܱӮۿၹ,ࢤሢิԛ၂สࣖჵս۽ᇅᄯᄯ、ٿል֞ҩ൫֥ࠢӮቆࡱᇅᄯӌ(integrateddevice֥ڛༀᇅᄯଆൔ,ၛቔູఃս۽ӌഅໃটܙmanufacturer,IDM)。1987୍ࠒ(TaiwanSemi-ሇࣉڛༀᇅᄯ֥ҕॉ,ቋުбࢠ҂ڛༀᇅᄯconductorManufacturingCompany,TSMC)ิԛህြׅ֥ࣖٓӁြࡎᆴ౷ཌᆭ,ิԛ4ᇕׅѩࡹၰჵս۽֥Էྍഅြଆൔ,֤Ӂြ܂ႋ৽ؿള్۩Ґ౼ྴࠢӮٚൔॖၛࠆ֤ࢠ֥ۚڛༀࡎᆴა০აᇗቆ,ѩტਔྸ؟ࣖჵӌ֥ࠢӮਫ਼(inte-。gratedcircuit,IC)ഡ࠹܄ඳ,طު؍֥ٿልაҩ൫܄ඳ္ၹࠆ֤ࣖჵս۽ӌิ܂֥ሇЇڛༀ(turn-key1 ڛༀᇅᄯservice)רֆط֤ၛളթؿᅚ,Ӂြࢲܒषሼཟٳෛሢഠ߶ࣉ҄აഅြ߄֥ؿᅚ,Ӂሼཟ؟ჭ۽。Ֆ2000୍ࣖჵս۽षֻ2Ց֥അြଆൔԷ߄,གྷս߄֥ڛༀࣜ࠶აᆩ്ࣜ࠶֥Էྍ׀ڭਔၛྍ,ࣖჵᇅᄯӌᄝICഡ࠹ࢨ؍ࢲކ݁ᆩ്Ӂಃ(in-Ӂࣜ࠶ູ֝ཟ֥Ԯනົ。1966୍Greenfieldᄝtellectualproperty,IP)ӌഅषิ܂ഡ࠹ڛༀ,ၛᇅ࣮ڛༀြࠣఃٳো֥ൈީ,൮؇ิԛളӁྟڛༀᄯູᇶุ֥ࣖჵս۽ြၛྴࠢӮ֥ٚൔิ܂ྴ(producerservice)֥ۀ。ႵљႿཨٮྟڛༀ(con-IDM֥Ӂۿି。ၹႋӁഡ࠹گᄖ؇ิۚၛࠣજsumerservice),ളӁྟڛༀٗᆷ෮Ⴕ֥ᇏࡗೆӁཟோഈ༢(systemonchip,SOC)֥൝,ᆃՑഅြ,൞ϴෛሢఒြളӁطࣉྛ֥ࠃ,ఃٓຶЇওଆൔԷྍစളਔཞԷၩሰ(GlobalUnichipCorp,[1]࣮ؿᅚ、ܵሦ࿘、۽ӱڛༀ、ᄎԔܵ、Ӂົྩ,GUC)֩ህြഡ࠹ڛༀ܄ඳ,ᆃ҂ࣇॖၛႵི෪؋ၛᇀႿఒြمੰაࣁವڛༀ֩。ਸ਼ຓ,ڛༀြ࣮ྍӁषؿაഈ൧֥ൈࡗ,ಞICഡ࠹ြᆀაIDM܄ສສ္߶ႨളӁྟڛༀြটބᇅᄯြбࢠ,ၹູఃඳህᇿᄝӁഡ࠹აषؿ,ൈ္ॖၛಞܤग़ᄝഡ[5-6]ളӁหྟބᇅᄯြႵбࢠݺ֥ܱ৳ྟ。ќ࠹ഈิᄪॉ੮ᇅᄯၛࠣӮЧၹ,ઋൌॖᇅᄯྟഡ[7][2]֩ࠎႿᇅᄯြ֥ࡎᆴ৽,ิԛਔ૫ཟᇅᄯြ֥ള࠹(designformanufacturing,DFM)֥。ᆃ2[3]Ӂྟڛༀࡏܒ,ิ܂Їওྐ༏ڛༀ、ࣁವЌགڛༀ、ՑഅြଆൔԷྍ֥Ӂြളೂ1෮ൕ。ੀڛༀ、ඌڛༀ、അༀڛༀၛࠣఃӁြڛༀ֩6ᇕڛༀ,ѩࢲކൌ࠽σ২݂ବਔ3ᇕׅ֥ႏᄎଆൔ。1)ᇅᄯഅሱႏڛༀ:ᇅᄯഅሱ࠭Ӯ৫ڛༀ҆(২ೂሱ࠭Ϸ܄൩֥ะົྩЌအ)。2)ڛༀຓЇ:ЌႵނྏࣩᆚ৯֥ඌ,طࡼ٤ނྏڛༀြༀຓЇ۳ህြӌഅڵᄳ。3)ᇅᄯഅაڛༀӌഅކቔڛༀ:ؽᆀᆌؓдՎ֥Ⴊਜ൝ࢩӉҀ؋,ؿߨކቔ֥ሸི。Ֆਸ਼၂ٚ૫টु,ᇅᄯြສڛༀြ֥ؿᅚ۷൞[8]୍࣍টᇗေ֥ဆэ。1990୍Druckerิԛྍᇅᄯ1 ࣖჵս۽ᇅᄯ֥അြଆൔԷྍ Thebusinessmodelinnovationofwaferfoundryြ(newmanufacturing)֥ۀ,ಪູྍᇅᄯ֥ൌᇉ҂
ֻ2௹ࡥᨃڶ,ݒಥը:ڛༀᇅᄯބࠒᇅᄯڛༀଆൔ 3ᄜ൞ࠏྀ߄(mechanical),ط൞ۀ߄(conceptual),ڛༀᇅᄯ֥3۱ࠎെ,ᆀླྀԷᄯఒြࡎᆴބ[9]ླေྍ֥ܵٚمაᇅᄯં。Drukerࣉ၂҄ᆷܤग़ࡎᆴ。ࢶႮڛༀᇅᄯ,ܤग़ҕაᇅᄯ,ᇅᄯ္ԛᇅᄯ֥ఏׄ҂൞ေളӁބᇅᄯӁ,ط൞ေളӁླྀӁഡ࠹აཧ(ෂཧ൲),ᄵఒြაܤग़ࢥԛ“ڛༀ”ၛ֤ग़ॖၛԉٳ֤֞টሱӁ֥০ॖၹԷྍطิശఃࡎᆴ。ၭ,ၹູӁ൞ӮЧᇏྏ,ڛༀᄵ൞০ᇏྏ。[10]QuinnऎุิԛਔၛڛༀູࠎԤ֥ఒြۀ,ඪૼڛༀؓႿᇅᄯြࡎᆴԷᄯၛࠣЌӻఃӉ௹ࣩᆚႪ൝֥ᇗေྟ。ਸ਼ຓႵུ࿐ᆀ֥࣮ᄵᄝק໊ڛༀაӁ[11]ᆭࡗ֥ܱ৳,২ೂMarceau֩ಪູؓႿᇅᄯაڛༀ֥шࢸᄀটᄀଆ,ఃቋݺ֥ࢳ൞ࡼӁြुቔ൞၂۱Ӂ༢,ᇅᄯაڛༀᄝڛༀૡࠢӁ֥ളӁᇏ۲ሱϲဆ෮ླ֥࢘。ૌࡼڛༀބᇅᄯ֥ܱ৳ٳູ3۱ࢨ؍:ӈܿࢨ؍、ຩ߄ބຓܓࢨ؍,ၛࠣӁ-ڛༀЇࢨ؍,طֻ3۱ࢨ؍ᆞ൞གྷսᇅᄯြؿᅚ֥൝。ఒြཧ൲֥҂ᆺ൞Ӂ,ط൞ၛޅൔቆކ֥Ӂ-ڛༀЇ。2 ڛༀᇅᄯ֥ۀ[12]Berger֩ิԛਔڛༀᄹ఼ᇅᄯြ( Conceptofservice-embeddedmanufacturingenhancedmanufacturing)֥ۀ,ಪູӁളӁ֥[17] ລႋઌ఼טڛༀᇅᄯ҂ࣇႵ০Ⴟఒြ֥ᇅᄯഅ,ႋሇཟڛༀᄹ఼ᇅᄯြ,മᇀᄝࠞ؊ሑঃࡎᆴิശ,ൈ္ႵᇹႿݓࡅӁြࢲܒ֥ശࠩ。ၛ༯္ॖປಆሇӮิ܂ᆜุࢳथٚσ֥ڛༀြ。Ԣਔᇏݓູ২,ᄝಆ౯ᇅᄯ֥Ӂြ৽ჰЧϲဆս۽֥࢘ڛༀᄹ఼ᇅᄯຓ,္Ⴕ၂ུӫ҂൞Чᇉഈ,ݖڛༀᇅᄯॖ՜ࣉՖᇏݓս۽эӮᇏݓᇅোර֥ۀ,২ೂࠎႿڛༀ֥ᇅᄯ(service-basedᄯ֥ሇэ。ൈڛༀᇅᄯ္ႵᇹႿݓࡅთࣜ࠶[13]manufacturing)ࠇ൞ၛڛༀູ֝ཟ֥ᇅᄯ(service-ླྀטؿᅚၛࠣݓࡅԷྍุ༢э۪֩ޡܴ֥ݓࡅҪ૫[14]orientedmanufacturing),఼טᇅᄯြླࡆೆڛᆭࡎᆴิശ。ༀ֥ࣚപቓູఃིࠛޙਈ֥ᆷᆌ,ҌॖၛϺᇹᇅᄯြิശఃࣩᆚ৯。ਸ਼၂۱ཌྷܱ֥ӫᇅᄯڛༀ2 ࣖჵս۽ᇅᄯ֥ڛༀᇅᄯׅٓ-(manufacturingservice)ᄵჷሱႿӁြࢸ֥ս۽ᇅᄯ,ၛTSMCູ২ၹս۽ᇅᄯ֥ڛༀٓຶᇯ҄ঔն,෮ၛࣼٗӫູᇅ ᄝՎᆜࣖჵս۽֥ڛༀᇅᄯଽݤ,ѩၛᄯڛༀ,ࢠູದඃᆩ֥ࣼ൞ሰြᇅᄯڛༀ(elec-TSMCູൌᆣσ২,ฐษࣖჵս۽ڛༀᇅᄯଆൔ֥[15]tronicmanufacturingservice,EMS)。ၛഈᆃ఼ུܱӮۿၹ。߄ᇅᄯြڛༀଽݤ֥ളӁଆൔॖ݂ବӫູڛༀྟ ࣖჵս۽ᇅᄯڛༀᄝڛༀᇅᄯ֥ଽݤളӁ。Ч࣮ၛڛༀᇅᄯ֥3۱ࠎെটٳ༅ࣖჵսളӁྟڛༀ൞ᄝڛༀြ૫ࡼิ܂ڛༀ֥ؓའ۽Ӂြ֥ଽݤ,ೂ3෮ൕ。ࣖჵս۽ᄝഅြଆൔ఼טᄝളӁᆀࠇ൞൧ӆ֥ᇏࡗೆ,ࢶႮളӁྟڛֻ֥1ՑԷྍ൞ၛڛༀྟളӁᆃ၂ଢѓູభี。ሢༀॖၛࡼᇅᄯြ֥ࡎᆴ৽ཟ൧ӆഥ;طڛༀྟളငႿ϶ุ֝ഡС֥ሧࣁحஔն,ྸ؟ႵӁԷྍӁᄵ൞఼߄ਔᇅᄯြЧദ֥ڛༀۿି,ၛิശః܄֥ICഡ࠹ᆀೂݔીႵࣖჵս۽ြิ܂Ӂି۴Ч[16]ඳაӁ֥ࣩᆚ৯。ਟ֩ಪູളӁྟڛༀمൌགྷఃԷྍ,Ԣ٤ࡼఃԷၩછ۳IDMӌ,ᆃ္൞϶აڛༀྟളӁᆺࢳथਔೂޅᇅᄯӁࠣ၇ກӁᅚุ֝ؿᅚ֥၂նཋᇅ。ၹՎࣖჵս۽֥ԛؿׄࣼ൞षڛༀ֥໙ี,ѩીႵᅳ֞ڛༀ֥ଢѓၛࢳथູජေཟᆃུICഡ࠹ᆀิ܂ᇅᄯڛༀ,ࠇᆀඪ൞ڛༀྟڛༀ֥໙ี。ఒြေିԷᄯࣩᆚႪ൝,ਔࢳܤग़ࡎളӁ֥۽ቔ。ࠧࣖჵս۽ӌЧദمิ܂ປᆜ֥ᆴ֥ଽളݖӱѩิ܂ડቀఃࡎᆴളӮݖӱ֥ᆜสӁభ؍ܻᅷളӁބު؍ٿልაҩ൫ڛༀ,ૌߎ൞൞၂۱ܱေ。ૌၹՎิԛਔڛༀᇅᄯ߶ၛҦ৳ૐٚൔูܤग़ࡼြༀሇЇ۳ކቔӌഅ,ಞܤग़ॖၛࢳथ෮ႵളӁ֥໙ี。෮ၛڛༀྟളӁ(service-embeddedmanufacturing)֥ۀ(2)。ള൞ࣖჵս۽ြ֥ࠎЧڛༀ。Ӂྟڛༀ、ڛༀྟളӁ,ၛࠣܤग़֥ಆӱҕაܒӮਔ
۽ ြ ۽ ӱֻ16ज 4ڛༀࣚപ,۷ေႵປ֥ܵაྐ༏༢ކҌॖൌགྷ。 TSMCᄝڛༀᇅᄯ֥ܱӮۿၹTSMC҂ࣇ൞ࣖჵս۽അြଆൔ֥Էྍᆀ,္൞ࣖჵս۽ြ֥ႄਵᆀ,ఃႏ൬ჿᅝಆ౯ࣖჵս۽ሹӁᆴ֥50%,طః༵ࣉ֥϶ุ֝ᇅᄯඌ္აIDMਵ֝ӌഅIntelࠣIBM֩ѩࡐఊ౺。ྸ؟ުࣉ֥ࣖჵս۽ӌഅ္ၛTSMC-likeູଢѓ。ၹՎฐษఃӮູڛༀᇅᄯ֥ܱӮۿၹႵᇹႿׅ֥ٓ࿐༝。Ч࣮ᄝڛༀྟളӁაളӁྟڛༀ֥ٓԐ۲ೱ࿊၂ཛTSMC֥ܱӮۿၹ,طᄝܤग़ಆӱҕა3 ࣖჵս۽Ӂြ֥ڛༀᇅᄯଽݤٚ૫ᄵႵࢠ؟֥ฐษ。 Service-embeddedmanufacturinginwaferfoundry1)࡙ऎധ؇აܼ؇֥ᇅᄯඌ。 ࣼളӁྟڛༀ֥ܴׄটु,ࣖჵս۽ြ္ေิᄝڛༀྟളӁٚ૫,TSMC֥അြଆൔֻ၂ՑԷ܂ICᇅᄯၛຓ֥ఃڛༀ,ၛડቀܤग़ᄝӁڸࡆྍᄯࣼਔࣖჵս۽Ӂြ,་ႄྸ؟ࣩᆚᆀ֥ࣉೆ,ᆃۿି֥ླ。ᆃ္൞ࣖჵս۽അြଆൔֻ2ՑԷྍུ۵ࣉ֥ӌഅॖၛิ܂ս۽ڛༀ,TSMCିӻ֥ු。ࣖჵս۽֥ܤग़൞ICഡ࠹܄ඳࠇIDMӌ,࿃ЌႵࣩᆚ৯,ఃᇶေჰၹݖႿऎႵ఼ն֥ሱᇶૌႚႵஇ、൧ӆაཧܵ֡,෮ၛᆃུܤग़ቋᇗᇅᄯඌ,҂؎ೆؿѩঔնඌܼ؇აധ؇,ᄝ൪֥Ӂڸࡆۿି൞Ӂ൞ڎॖၛॹဒᆣაਈധ؇ٚ૫ၛଉغקੰ(Moore’slaw,ૄ18۱ᄅุࣖӁ,ၛղ֞ॹൌགྷഈ൧ࠆ০֥ଢѓ。෮ၛࣖჵսܵಸਈࡆП)ᄝᇅᄯඌՖՑັ(μm)ဆࣉ֞ବ۽ᇅᄯြࠫࡅਵ֝ӌഅ۲ሱބ҂֥ICഡ࠹ڛ(nm);ᄝܼ؇ٚ૫ՖѓሙઆࠠӁԛؿ,ࡼս۽ਵༀ܄ඳࢲૐ,ཞ൞TSMCބGUC,৳(UnitedMicro-თഥ֞ۋܻቆࡱ、౺ICၛࠣჷܵIC֩หelectronicsCorporation,UMC)ބᇆჰ॓,ၛࠣGlob-൹ᇅӱၛડቀܤग़؟ဢ߄֥ླ,ఃᇅӱඌ֥alFoundryބޞࣖ॓֩,ၛԷᄯࣖჵս۽Ӂြ֥ളؿᅚٚཟೂ4෮ൕ,ޫႋݓ࠽϶ุ֝ඌড(In-༢(ecosystem),ѩઋൌॖᇅᄯྟഡ࠹(designternationalTechnologyRoadmapofSemiconductors,formanufacturing,DFM)֥。֒ಖ,ః֥ളӁ[19]ITRS)ิԛ֥϶ุ֝ؿᅚ൝,္ၹඌܼ؇აྟڛༀೂਅੱڿ、ܻᅷ܋Ӱ(҂ܤग़ॖၛ܋ཚധ؇֥҄ิശط֤ၛԷᄯ۷؟ܤग़֥ࡎᆴ。ཬ၂۱ܻᅷၛࢫസषؿӮЧ)、ॖौ؇ٳ༅ࠇ൞ఃࠎ֥ࣖჵս۽ӌഅ؟ඔᆺିᄝหק֥ඌ༯ิ܂หקЧग़ڛༀ္֩൞ളӁྟڛༀ֥ٓԐ。Ӂ֥ս۽,مཞTSMCϮႵ࡙ऎധ؇აܼ؇֥ᇀႿܤग़ಆӱҕა,ᆃ൞ܤग़ڛༀԷྍ֥ᄹᆴඌ,ၹՎఃڛༀ֥ܤग़ಕࠣڛༀଽಸࣼбࢠႵཋ。ڛༀ。҂ᆺ൞അြଆൔڿэ,ߎсྶଽ߄Ӯᆇᆞಞܤग़ᆰࢤႵҕაۋѩิശఃࡎᆴ。Էᄯࣖჵս۽ଆൔ֥ᅦᇑଔᆷԛ,21ൗࡀࣖჵս۽Ӂြॖၛӻ࿃ӮӉ֥၂۱ᇗေܱၹ൞ބܤग़ࡹ৫ധೆطܼ֥ٗࠄϴܱ༢,طఃᇗׄࣼ൞ಞܤग़Ֆᇅᄯ۽ၜ、ICഡ[18]࠹֞ਈӁᇅᄯބࣖჵս۽ӌЌӻࣅૡކቔ。ऎุቓم২ೂބܤग़৳ކࣉྛᇅᄯ۽ၜ֥ಒק,ॖၛ෪؋ਈӁൈࡗ;ྴࣖჵӌ(virtualfab)ॖၛಞܤग़٢ྏֹࡼӁࢌ۳ս۽ӌഅ,ѩิ܂бग़ሱ֥࠭ࣖჵӌ۷ݺ֥ᇉ;ۚ؇֥ളӁྟॖၛડቀܤग़նܿଆקᇅ(masscustomization)֥ླ֩;ປᆜ֥܂ႋ৽ܵॖၛิ܂ܤग़Ⴊ߄֥ြༀੀӱӮЧܵ֩。ᆃུ൞Էྍܤग़ࡎᆴ֥ᄹᆴڛༀ,္൞ቋ4 TSMCඌؿᅚ֥ٚཟ TechnologydevelopmentdirectioninTSMC֥҆ٺ。҂ࣇ܄ඳေႵܤग़֝ཟ֥ࣜႏა
ֻ2௹ࡥᨃڶ,ݒಥը:ڛༀᇅᄯބࠒᇅᄯڛༀଆൔ 5Վຓ,ࣖჵᇅᄯඌ൞ࣉೆࣖჵս۽Ӂြ֥ࠎЧၛࠣުླྀڛༀ֩҂૫ཟ֥ൌൈაڛༀ,ᄝࡪ,ᅧਔࣖჵᇅᄯඌުᄜॉ੮൞ڎສഈႳ֥ܻ϶ุ֝ࣉೆཨٮྟሰൈս,ӁࠢӮ؇ۚ、ളଁᇛ[23]ᅷᇅቔࠇ༯Ⴓ֥ٿልҩ൫ࠢӮؿᅚ,ࠇႨҦ৳ૐ௹෪؋、ླэն֩็ᅞ༯,ิ܂ܤग़෪؋ഈ൧ٚൔิ܂ሇЇڛༀ。ൈࡗ(timetomarket)、ਈӁൈࡗ(timetovolume)ၛࠣ 2)ष٢ൔ֥ഡ࠹ڛༀ。ࢌࠊൈࡗ(timetodelivery)֥؟ᇗࡎᆴ。ളӁྟڛༀ൞ᄝऎСڛༀྟളӁުؓܤग़ิ܂֥ᄹᆴڛༀ。ཬ֥ࣖჵս۽ӌഅିิ܂ӱ؇҂၂֥ਅੱิശაॖौ؇ٳ༅ڛༀ,ᆺႵ൧ᅝੱࢠ֥ۚࠫࡅြᆀປӮֻ2ՑԷྍطิ܂ປᆜ֥ഡ࠹ڛༀ。TSMC҂ࣇᄝ܄ඳଽ҆Ⴕህದჴิ܂ᄪ௹ؿഡ࠹ڛༀ,ߎᄝຓ҆აԷၩሰކቔิ܂ਈӁ֥[20]ഡ࠹ڛༀ。ᄝ2008୍۷ࣉ၂҄ิԛष٢Էྍࡏܒ(openinnovationplatform,OIP),ࡼTSMCЧദၛࠣഡ࠹ڛༀކቔࠄϴႚႵ֥ICഡ࠹ڣᇹ۽ऎ、݁ᆩ്ӁಃIPၛࠣቋྍ֥ᇅӱඌྐ༏ष٢۳ఃܤग़,ಞ෮Ⴕ֥ICഡ࠹ြᆀࠣIDM܄ඳॖၛ၇Վॹഡ࠹Ӂ,ѩ֝ೆDFMඌၛაᇅᄯࣅૡࠢӮ。ᆃဢ֥ቓم҂ࣇᆰࢤܝৣఃఒြࠄϴ֥Էྍ,5 TSMC֥ྴࣖჵӌࡏܒ္ಞఃܤग़၇࠻קܿ۬ሱಖವೆTSMC֥Ӂြ܂ႋ VirtualFabframeworkinTSMC৽,TSMCॖၛބఃഈ༯Ⴓ֥ކቔࠄϴࡹܒԛӁြ֥ള༢。ՖളӁྟڛༀ֥࢘؇টु 4)ၛڛༀູ֝ཟ֥܄ඳ໓߄。,TSMC֥ष٢Էྍ۷൞ӑᄀఃࣖჵս۽ӌିิ܂֥ഡ࠹ڛTSMCՖఃҦ჻ࣟ、ނྏࡎᆴၛࠣࣜႏༀᆭٓԐ,ॖႵིϺᇹܤग़ࡆԷྍطิശࡎᆴᄝཁڛༀ֥ࣚപ。TSMC֥჻ࣟ൞“Ӯູಆ౯ቋ༵。ࣉࠣቋն֥ህြࠢӮਫ਼ඌࠣᇅᄯڛༀြᆀ,ѩ3)ྴࣖჵӌ֥Ӯۿൌ。ྴࣖჵӌჰၩ൞ٟᆇս۽ӌ(simაࣖჵӌഡ࠹܄ඳࠣࠢӮቆࡱᇅᄯഅ֥ग़ಕulated[21]fab),ݖٟᆇඌಞྍ֥ࣖჵӌބ࠻Ⴕ֥ࣖჵ܋ቆӮ϶ุ֝Ӂြᇏࡔ఼֥ࣩᆚؒ”。ູղՎӌൈթᄝ,ၛࡆ۽ӱषؿა۽ӌܿ߃。TSMC఼჻ࣟ,TSMC҂ࣇсྶ൞ඌਵ֝ᆀაᇅᄯਵ֝ᆀ,טܤग़ڛༀ֥ࣚപ,ေсྶӮູܤग़֥ྴࣖჵൈ۷сྶ൞“ၛڛༀູ֝ཟ,ၛࠣग़ቋնᆜุ০ӌ,ఃଽݤᄵ൞༐ຬܤग़൪TSMCູሱ֥࠭۽ӌ,ၭ֥ิ܂ᆀ”。ھ܄ඳ֥4նނྏࡎᆴ:Ӵྐᆞᆰൈေቓ֤бܤग़֥ࣖჵӌߎݺ。TSMCࢹᇹྐ༏(integrity)、ӵ୶(commitment)、Էྍ(innovation)ၛ[22]ඌ֥ؿᅚটൌགྷᆃ۱མ。ܤग़ॖၛ๙ݖ৳ࠣग़ࠄϴܱ༢(customerpartnership)۷൞ᄝఒြຩൌൈਔࢳః༯ֆ֥ྉோളӁࣉ؇,ܤग़ႵАჼ္ଽՖഈ֞༯ᇿೆᇗ൪ܤग़ڛༀაԷྍࡎᆴ֥ࣚപ。ॖᆰࢤ๙ݖ࠹ෘࠏ༢ॹّ႘ѩࠆ֤ࢳथ。ਸ਼ຓఃնࣜႏԢ఼ט“ग़ࠄϴܱ༢”ຓ,္TSMC֥ྴࣖჵӌᇶေࡏܒೂ5෮ൕ。๙ݖაၛሔѩົӻ“ग़ಆ૫ડၩ”֥ᇉቔູ܄ඳಥᇅᄯᆳྛ༢MES、ఒြሧჷܿ߃༢ERP、ࠣӁ۽ቔაڛༀ֥ჰᄵ。TSMC఼טՖ൙֥҂൞ᇅᄯြඔऌܵ༢PDM֥ࠢӮ,ॖಞܤग़ൌൈࠆ֤ࣖჵط൞ڛༀြ,ѩᄝ܄ඳଽ҆ิ܂ࢂৣၛܝৣჴ۽֥ӌ֥сေྐ༏。TSMC-Onlineิ܂ܤग़רֆ֥ളӁܤग़ڛༀაԷྍࣚപ,ႮՎॖၛڛༀູ֝ཟ֥ఒაࢌࠊሑঃ,္ᆦӻܤग़ॖၛཌഈബނඌ໓ࡱაြ໓߄ၘᄝTSMCധ۶。ਅੱٳ༅ሧਘ,൞၂Ϯܤग़ࢥॖႨ֥ࠎЧڛༀ;5)նܿଆקᇅ֥ᇅᄯྟ。TSMC-Direct൞၂۱৵ࢤTSMC༢აܤग़༢֥TSMC֥ᇅᄯି৯Ⴊ൝Ԣਔਅੱิശ؇ॹూਃ,္ॖၛԩ҂܄ඳࡗ֥۽ӱሧਘࢌߐ໙(नૄ၂࠱ิശ6%)、Ӂॖौ؇ۚ(ၛࣖჵ࠹ෘี,൞၂۱حຓ֥ܤग़ڛༀ。ં൞ପ၂ᇕ༢,ᆭࠊੱᄝ2005୍ູ%)ၛࠣӁ֝ೆਈӁ[24]TSMCॖิ܂ܤग़ഡ࠹ླྀڛༀ、۽ӱླྀڛༀ,؇ॹ(ਵ༵ြ6۱ᄅၛഈ)ᆭຓ,ਸ਼၂۱ᇗေ֥
۽ ြ ۽ ӱֻ16ज 6หྟ൞ఃᆌؓ҂ܤग़ླطิ܂֥նܿଆקᇅڛӁྟڛༀഈ૫֥。ᇀႿܤग़ಆӱҕაᄵ൞۷ࣉ၂҄ༀ。TSMCႚႵ6⩱、8⩱ა12⩱ࣖჵӌ,ᇅӱඌ֥ࡎᆴิശ,ಞܤग़ࢶႮაࣖჵս۽֥ླྀކቔطॴᄀՖ֞45nm֩҂ൗս,ӁಕടࠣՖᄹࡆఃჰЧ৫ቔြ෮مղ֥֞ࡎᆴ(২ೂ৳ކઆࠠӁ֞ྉோ、႕ཞԮۋఖ֩҂ႋႨਵთ。षؿॖၛࢆ֮ఃؿӮЧѩ෪؋ഈ൧ൈࡗ)。ၹՎई২ط,TSMCଖ8⩱ӌᄝֻ၂୍ਈӁࠧႵӑݖളӁྟڛༀ֥ࡎᆴࢠ֮,ڛༀྟളӁंႿᇏࡗ,طܤ90۱ܤग़,400ᇕၛഈӁൈᄝཌഈളӁ,طఃग़ಆӱҕაᄵႚႵቋ֥ۚڸࡆࡎᆴ。[3]ਅੱᄝ90%ၛഈ。ᆃུ҂ਵთ֥ܤग़۲Ⴕఃࣉ၂҄ॖࡼࣖჵս۽ڛༀᇅᄯ֥3۱ࠎെ۱҂֥ᇅӱླაܿ۬,TSMC҂ࣇิ܂ҕॉᇅљࢳܒఃࠎЧေაحຓေ。ࠎЧေ൞ᆷ၂Ϯࣖჵս۽ӌഅࣉ၂҄ؿᅚӮູڛༀᇅᄯ֥сေ่ӱಞܤग़ॖၛॹਈӁ,ਸ਼၂ٚ૫္ିิ܂ग़קࡱ,طحຓေᄵ൞ေཞTSMC၂ဢӮູሜᄀਵ֝ᇅ֥ྟ。๙ӈᆃᇕקᇅ֥ڛༀࢠٮൈٮ৯,۽ӌഅ෮ႋऎС֥ܱӮۿေ。Ч࣮ิԛೂ6ӌႏᄎಸၞၹՎطᄯӮིੱ֮༯,TSMCಏି෮ൕ֥ࣖჵս۽ڛༀᇅᄯࡏܒ。ෙಖڛༀྟളӁݖః࠹ෘࠏࠢӮᇅᄯ(CIM)֥ڣᇹაଽ҆ܵٚمࠣളӁྟڛༀٳљ൞ֻ၂ՑԷྍֻࠣؽՑԷྍࢨ؍क़ڛᆃུཋᇅ,ᄝնܿଆקᇅ֥ߌ༯ಯି҂؎ิ[3,25]֥ؿᅚᇶᇠ,ૌಯྶᄝު࿃ࢨ؍Ќӻᆭభ֥ڛശఃིି。TSMCᄝิശᇅᄯྟ֥ٚمЇও:ༀඣሙҌିᄝڛༀᇅᄯ֥ࢨ؍ൈ࡙ऎ3۱ࠎa)ॴӌ֥Ӂିᆦӻଆൔ,ࢶႮ࣠ࠏ֥ᇗٳെ。֒ࣖჵս۽ၘؿᅚӮڛༀᇅᄯြ,Ч࣮ӫၛࡼഺჅࠏӁିԉٳ০Ⴈ;b)҂ඌൗսࡗ֥ᆭູ϶ุ֝ᇅᄯڛༀ(SMS)。Ӂିࢌߐࠏᇅ,ᄝ၂۽ӌଽࣉྛӁቆކ֥ࠏ҂ࣖჵս۽ӌഅؿᅚڛༀᇅᄯ֥ӱ؇აਫ਼טᆜ;c)ิശ࣠ࠏ֥ഡСሸི(overallequip-[26]ࣥॖି߶Ⴕҵၳ。Ч࣮࿊౼նሸކࣖჵս۽menteffectiveness,OEE)ࠣሸކࣖჵིၭ(overall[2]ӌഅTSMCࠣUMC、ཬሸކս۽ӌഅೂൗࢸ༵ࣉwafereffectiveness,OWE),ၛх૧ᄹࡆሧЧᆦԛ֥(VanguardInternationalSemiconductor,VIS)ބDong-ٚൔᄹࡆӁି。buၛࠣཬห൹ᇅӱս۽ӌഅೂTowerJazzބX-ၛഈٳ༅ࣖჵս۽ᄝڛༀᇅᄯ֥ଽݤၛࠣਵFab֩6ࡅ܄ඳটбࢠఃؿᅚӮSMS֥ӱ؇,ೂі֝ӌഅTSMCҵၳ߄֥ܱӮۿၹ。༯၂ࢫࡼؿ1෮ൕ。ᅚࣖჵս۽ࣉೆڛༀᇅᄯӮູ϶ุ֝ᇅᄯڛༀ Ֆі1֥бࢠॖၛؿགྷ,၂Ϯ֥ሸކࣖჵս۽(SMS)֥ଆൔ。ӌఃڛༀᇅᄯ֥ؿᅚٚཟ؟აЧ࣮ิԛ֥ࡏܒཌྷژ,ᆺ൞ఃӱ؇Ⴕ෮҂。նս۽ӌ֥ؿᅚቋ3 ࣖჵս۽֥ڛༀᇅᄯଆൔູఊಆ,UMCބTSMC؟ିิ܂ປᆜ֥ڛༀ,ਵࡼࣖჵս۽֥ڛༀᇅᄯቆӮٳࢳӮࠎЧေ֝ӌഅTSMCᄝࠎЧေ֥ܻᅷ܋Ӱ、ܻᅷڛༀ֩აࡆᆴေ,ѩၛӁ֥܂ႋ৽ࠣཌྷؓิ܂֥ڛༀཛଢ,ၛࠣحຓࡎᆴ֥ڛༀေೂྴࣖჵӌ、षࡎᆴটٳ༅ఃေᆭປСྟ。٢ൔഡ࠹ڛༀߎ൞бUMCႵࢠປᆜڛༀ。ཬ֥ ࣖჵս۽֥ڛༀᇅᄯࡏܒሸކս۽ӌೂVISაDongbuఃؿᅚଆൔ္۵ෛՖൈࡗ༵ުඨটु,3֥ඪૼၘࣜࡼࣖჵሢնሸކս۽ӌ֥ࣥ,ၹ܄ඳ֥ሧჷაඌս۽അြଆൔֻ֥1ՑԷྍֻࠣ2ՑԷྍٳљ৵ࢲି৯Ⴕཋ,෮ၛն؟ඔᆺିิ܂ᇏ֩ᇉਈ֥ڛༀ,֞ڛༀྟളӁაളӁྟڛༀ֥ଽݤ,ᆃ္іൕ๙ӈၛڛༀྟളӁၛࠣളӁྟڛༀູᇶ,ᄝܤग़ಆӱࣖჵս۽֥ؿᅚଆൔ൞༵ؿᅚڛༀྟളӁ,ಖުᄜҕაഈ֥ڛༀࢠഒ。ਸ਼ຓбࢠหљ֥൞ཞX-FabބؿᅚളӁྟڛༀ。ᇀႿܤग़ಆӱҕაࠎЧഈॖၛՖTowerJazzᆃᇕህᇿႿห൹ᇅӱս۽֥ཬս۽ӌ。ളӁྟڛༀष్ೆ,ေିປಆؿᅚᄵсྶေᄝᆃུ܄ඳህྏؿᅚ০ࠎ֥ᇅӱೂັࠏ(microളӁྟڛༀປСᆭު。ၹՎ,ڛༀᇅᄯ֥3۱ࠎelectromechanicalsystem,MEMS)、݁ᆁ(silicon-െ༵ުඨٳљ൞ളӁྟڛༀ、ڛༀྟളӁၛࠣܤgermanium)ᆭս۽。ૌ֥ؿᅚଆൔбࢠหљ,఼ग़ಆӱҕა。טބหקܤग़֥ླྀކቔ,෮ၛᄝܤग़ಆӱҕაٚՖܤग़ڸࡆࡎᆴ֥࢘؇টु,ളӁྟڛༀ൞ࣖ૫ೂնܿଆקᇅა৳ކषؿ֩ေิ܂бఃཬჵս۽ࠎЧ֥ࡎᆴ,طڛༀྟളӁᄵࡼളӁႵܱ֥ሸކս۽ӌ۷ປᆜ֥ڛༀ,ᄝളӁྟڛༀഈࣼࢠഈ༯ႳࠃࣉྛࠢӮڛༀ,෮ၛఃࡎᆴ൞ڸࡆᄝളሸކս۽ӌഒ。
ֻ2௹ࡥᨃڶ,ݒಥը:ڛༀᇅᄯބࠒᇅᄯڛༀଆൔ 7і1 ࣖჵս۽SMSؿᅚӱ؇бࢠ SMSdevelopmentcomparisonofwaferfoundryࡎᆴࣖჵս۽܄ඳնሸކཬሸކཬห൹োљڛༀᇅᄯေTSMCUMCVISDongbuX-FabTowerJazz△△৳ކषؿ◎◎◎◎ܤग़ಆӱҕა܂ႋ৽ࠢӮ◎◎○○○○△△ഡ࠹ڛༀ◎◎○○△△ࠎܻᅷ܋Ӱ◎○○○ളӁྟڛༀ△△Чਅੱڿ◎◎○○△△ࡎॖौ؇ٳ༅◎◎○○ᆴྉோᇅᄯ◎◎◎◎◎◎△△△△△ܻᅷᇅᄯ◎ڛༀྟളӁ△△△△ٿልڛༀ○○△△△ҩ൫ڛༀ○○○ྴࣖჵӌ◎○○○○○ح△△ܤग़ಆӱҕაၛڛༀູ֝ཟ◎◎○○ຓ△△նܿଆקᇅ◎◎◎◎ࡎ△△△△ളӁྟڛༀष٢ൔഡ࠹ڛༀ◎○ᆴ△△ڛༀྟളӁധ؇აܼ؇֥ᇅᄯඌ◎◎○○△— ᇿ:◎—ิ܂ປᆜڛༀ;○—ิ܂ᇏ֩ڛༀ;ิ܂ഒਈڛༀ.ൡ໊֥֒ᇂѓൕԛট,ࣼॖၛປᆜֹࡼ۲۱ࢨ؍֥ڛༀଽಸቆކӮ၂۱ڛༀࡎᆴ৽,ೂ7෮ൕ。6 ࣖჵս۽֥ڛༀᇅᄯࡏܒ Service-embeddedmanufacturingframeworkinwaferfoundry7 SMS֥Ӂ܂ႋ৽VS.ڛༀࡎᆴ৽ SMS֥ڛༀࡎᆴ৽ࣖჵս۽ြᆀೂݔၘࣜؿᅚӮSMS,սіఃӁ ݖڛༀࡎᆴ৽֥ӯགྷၛࠣބӁ܂ႋ৽֥бြ֥ࡎᆴ৽ၘࣜՖӁ֥܂ႋ৽စളӮၛܤग़֥࢘ؓ,ॖၛဒ၂۱܄ඳࠇӁြ൞ڎၘࣜປᆜֹิ܂؇ູᇶุ֥ڛༀࡎᆴ৽(servicevaluechain)。Чࢫܤग़෮ླ֥ڛༀଽಸ。ೂݔॖၛປಆݤۂܤग़ླၛڛༀࡎᆴ৽֥ٚൔটဒSMSิ܂֥ڛༀປᆜ,ପહھ܄ඳ֥ᇅᄯଆൔࠧඋႿڛༀᇅᄯ;ೂݔྟ。Ⴕ҆ٳڛༀଽಸمડቀܤग़֥ླ,ᄵھ܄ඳ؋൮༵ࡼ௹ॖၛҐ౼ຓЇٚൔটڛༀܤग़,Ӊ௹طᄵေනSMS֥Ӂ܂ႋ৽ٳູՖඌؿ、ICഡ࠹、ܻᅷᇅᄯ、ࣖჵᇅᄯ、ٿልၛࠣҩ൫֩ࢨ؍ॉ൞ڎھࡹ৫۷ປᆜ֥ڛༀࡎᆴ৽。,ϴෛ֥Ӂ၇҂ࢨ؍Ֆܻᅷ、ࣖჵڛༀࡎᆴ৽֥ᇶุູྙ֥ڛༀط٤Ⴕྙ֥Ӂ,ቋުэӮࣖ。ᆃུڛༀ֥ࡎᆴটሱႿܤग़֥ᇶܴۋ൳,ೂڛ৬。ᆃ۱Ӂ܂ႋ৽ಒקᆭު,ᄜࡼSMS֥ڛༀༀ֥ᇉ、ൈࡗ、ྐ༏֩。෮ၛᄝႋႨഈߎေॉ੮ေᇅᄯิ܂֥ڛༀ၇ఃؓႋ֥Ӂ܂ႋ৽ࢨ؍ٳљᄝ
۽ ြ ۽ ӱֻ16ज 8[13]Ⴈଧུཛଢটޙਈࡎᆴڛༀ。Chaseࡹၰڛༀࡎ2෮ൕ。҂ં൞இࠇ൞ս۽ᇅᄯӌഅ,Ⴕࠏ߶ิᆴ֥ᇅᄯြԢਔ၂ϮᇅᄯြၛӮЧ、ᇉ、ྟࠣࢌ܂ڛༀᇅᄯ。இӌഅཞIBMა偠༆ܝڄࠏᄝڛࠊ௹ູིࠛޙਈᆷѓຓ,ߎႋᄜࡆೆIPSSቓູڛༀༀྟളӁ࿊ᄴຓЇ٤ނྏ֥ᇅᄯ,طᄝളӁྟڛ֥ᆷѓ。ఃᇏ,Iູinformation,ᆷิ܂ܤग़ളӁაႏༀഈ఼ט“၂পሰ”ൔ֥Ӯสڛༀ,Ֆֆ၂Ӂ֥ᇅᄎཌྷܱྐ༏;Pູproblemsolving,ᆷϺᇹܤग़ࢳथ໙ᄯᆀሇӮᆜุ༢ٚσ֥ิ܂ᆀ。ݚغࠢѩี֥ି৯;Sູsales,൞ᆷႋႨඌაӁၛڣᇹཧᇅᄯຓЇ֥གྷའ,ᄝܤग़ڛༀٚ૫ࡹ৫ਔሰഅༀ൲֥ି৯;Sູsupport,ᆷਬࡱูߐࠇҀԉթࠊ֥ିა൲ުڛༀ఼֥ն。ս۽ӌഅڶൖूაTSMCၛ৯。ᇅᄯູނྏ,ᄝڛༀྟളӁ္ิ܂“၂পሰ”ڛༀ,طᄝܤग़ಆӱҕაٚ૫ᇁ৯Ⴟնܿଆקᇅ֥ྟ,აܤग़৳ކഡ࠹षؿ,ၛࠣಞܤग़ުܤᆭႬ֥ުᆦӻุ༢(܂ႋ৽ܵაྴࣖჵӌ)。і2 ҂Ӂြڛༀᇅᄯଽݤ֥бࢠ Service-embeddedmanufacturingcomparisonindifferentindustryഅြ܄ඳڛༀྟളӁളӁྟڛༀܤग़ಆӱҕაଆൔྉோᇅᄯഅༀሦ࿘৳ຩڛༀIBMஇ࠹ෘఖ(ຓЇ)܂ႋ৽ܵᆜุࢳथٚσೈࡱग़ܱ༢ܵٚσഡ࠹8 TSMCაUMC֥ڛༀࡎᆴҵၳ偠༆ܣᅰᆐ؎༢இܝڄࠏ(ຓЇ)༢Ӯส܂ࠊ ServicevaluedifferencebetweenTSMCandUMCܝڄࠏࣁವವሧഡСሑܵ ᆌؓڛༀࡎᆴ֥ޙਈ,Ч࣮Ֆࣖჵս۽Ӂြ܂ࠊഅҕაഡ࠹ӮสܓઙڛༀݚغஇࡅӁ҂܄ඳ֥Ӂି০Ⴈੱࠣनֆ໊൲ࡎॖၛܴҳఃగӮสഡ࠹ֻٚੀഡ࠹ڛༀ৳ކഡ࠹ؓܤग़ิ܂֥ࡎᆴ。8൞൧ӆᅝႵੱభਆն܄ඳሰӁڶൖूս۽ቆልڛༀ܂ႋ৽ܵTSMCࠣUMCՖ2002୍֞2008୍ࡗ֥бࢠٳ༅。ଆऎෂڛༀնܿଆקᇅᄝᆃ؍௹ࡗၛԛࠊਈԢၛӁିট࠹ෘӁି০Ⴈੱ;ྉோᇅᄯഡ࠹ڛༀ৳ކषؿൈ࿊קၛ8⩱ࣖჵູսіট࠹ෘఃन൲ࡎ(ၹTSMCս۽ܻᅷᇅᄯܻᅷ܋Ӱྴࣖჵӌູ8⩱ࣖჵඌࢠູӮඃ൧ӆࣩᆚࠗਛ,ೂՎॖٿልҩ൫ڛༀॖौ؇ٳ༅նܿଆקᇅၛஆԢၹ12⩱ࣖჵඌҪՑ҂ᄯӮ֥൲ࡎҵ[27]ၳ)。Ӂି০Ⴈੱॖၛսіܤग़֥ᇑӴ؇(Ⴍః൞҂ Ֆീᆒ֥ັཱ౷ཌંটुᆃུӁြׅࣟగ֥ൈީ),طन൲ࡎᄵ൞ܤग़ؓႿڛༀࡎᆴٓؓࡎᆴ৽֥ڿэ:ၛؿაഡ࠹ູഈႳ,ᇅᄯ֥ऎุड़ק。Ֆ8֥бࢠॖၛؿགྷTSMCෙಖᄝაቆልູᇏႳ,طު؊Ӂ֥இაཧᄵູ༯Ⴓ,8⩱ࣖჵ૫ਢၹଉغקੰࠣြ֮ࡎࣩᆚ֝ᇁ֥ࢆᆌؓ5ࡅӌഅഅြଆൔ(இࠇս۽)ၛࠣఃაܤग़ࡎ৯,൞ఃࣖჵ൲ࡎ၂ᆰбUMCૄோۚԛࠣކቔӌഅܱ༢(ԼᆰࠢӮࠇྴࠢӮ),ॖٳູ4US¦100ၛഈ。ൈࠧః൲ࡎࢠြۚ,൞ఃӁᇕ,ೂ9෮ൕ,ఃᇏ֥SູჰЧ֥ັཱ౷ཌ,1ି০Ⴈੱಏି၂ᆰିົӻбUMCۚ15%ၛഈ֥ႪSᄵູࣉೆڛༀᇅᄯު֥౷ཌ,ޘᇠႮቐᇀႷູ2൝。ሸކᆃ2ᇕᆷѓ,ႮՎॖTSMCᄝิശܤग़Ӂြ֥ഈᇏ༯Ⴓ。ࡎᆴაڛༀഈ֥୭৯൞൳֞ܤग़ཌྷ֥֒ड़ק。ෙಖ ֻⅠ൞இӌഅၛྴࠢӮٚൔ,ࡼჰЧᇅఃቋնࣩᆚؓ൭UMC္൞ࠒֹࠞؿᅚӮູڛༀᄯ֥ᇶุຓЇ۳ކቔӌഅ,Чദᄵᇁ৯ႿഈႳഡ࠹ᇅᄯ,ఃࠎЧေ؟ၘປС,൞ᄝحຓေ֥ڛა༯Ⴓཧࠣஇ֥ࣜႏ,ᆃোၛIBMࠣ偠༆ܝༀഈಯTSMC၂Ԕ。ڄࠏູׅࠢ,ૌၛႵཋ֥ሧჷิ܂۳ܤग़۷ SMSაఃڛༀᇅᄯြ֥бࢠປᆜ֥ᆜุࢳथٚσڛༀ,ఃࡎᆴิശӱ؇ն。ֻ[16-17]бࢠӁြσ২ЇওIBM、偠༆ܝڄࠏࠢ、Ⅱ൞ս۽ӌഅၛྴࠢӮ֥ٚൔิ܂۳ܤग़ປᆜݚغࡅࠢࠣڶൖूڛༀᇅᄯ֥ൌσ২ೂіࢳथٚσ,TSMC൞ᆃ۱ଆൔ֥սі,ఃЧദಯၛս
ֻ2௹ࡥᨃڶ,ݒಥը:ڛༀᇅᄯބࠒᇅᄯڛༀଆൔ 9ᅚଆൔ൞ܤग़ಆӱҕაႪ༵ႿളӁྟڛༀ。3)ڛༀᇅᄯླေ、അြଆൔၛࠣඌ૫֥ކ。ڛༀᇅᄯحຓေсྶ࡙ऎ(ڛༀ֝ཟ֥໓߄)、അြଆൔ(ष٢ൔ֥ഡ࠹ڛༀ),ၛࠣඌᆦӻ(ᇅᄯඌ,նܿଆקᇅࠣྴࣖჵӌ֥ྐ༏ඌ)。4)ၛྴࠢӮٚൔ֥ڛༀᇅᄯࢠऎႪ൝。ၛྴࠢӮٚൔູᇶ֝ٳ۽ଆൔ֥இࠇս۽,ఃࡎᆴิശࡼۚႿԼᆰࠢӮଆൔ֥இࠇս۽。இ֥ྴࠢӮऎႵህᇿሧჷ֥Ⴊ൝;طս۽֥ྴࠢ9 ڛༀᇅᄯ֥ັཱ౷ཌэ߄ྙӮऎႵܤग़ࠄϴ֥ྐࠎԤ,ࢠಸၞၹކቔطӁള Smilecurveinservice-embeddedmanufacturingࡎᆴิശሸི。۽ڛༀູЧြ,ࢶႮაഈ༯ႳކቔࠄϴྙӮ֥ၹՎ,ڛༀᇅᄯ൞ໃট֥൝。ໃটႋႵ۷ecosystemಞܤग़ॖၛᄝഡ࠹აஇഈิശఃࡎᆴ,؟ൌ۱σ֥࣮,ၛဒᆣ࿐ඌં,ѩቔູࠎԤၛఃࡎᆴิശӱ؇აֻⅠཌྷ。ֻⅢ൞ս۽ӌഅࣉ၂҄՜ࣉڛༀᇅᄯ۷ധೆ֥࣮აؿᅚ。ӔԼᆰࠢӮ֥ٚൔᄎቔ,ఃׅ൞EMSӌഅ֥ڶൖू,ھ܄ඳቔູս۽ӌഅ֥ൈ,္ॴቀഈႳ֥ഡ࠹ҕॉ໓ང:Ӯູჰഡ࠹ᇅᄯഅ[1]ShihW,ShihC,ChienCF,:(originaldesignmanufacturer,Globalunichipcorp[R].Boston:HarvardBusinessSchool,ODM),ѩᄝ༯Ⴓ֥ཧ౻֡ഈิ܂ڛༀ。ᆃ۱ଆൔCase9-608-159,2008.ᇶေ൞Ⴎս۽ӌॴቀࢠۚڸࡆࡎᆴ֥ഈ༯Ⴓ۽ቔ,[2]ChienCF,HsuC,ോഈ༯Ⴓ֥ર০ၛҀቀᇅᄯЧദ֥֮ર০,ؓႿ(OWE):anovelindustrystandardforsemiconductorecosys-ᆜุࡎᆴ৽֥ิശӱ؇ࢠྴࠢӮ֮。ֻⅣ൞temasawhole[J].ComputersandIndustrialEngineering,இြᆀࡔӻԮ֥ԼᆰࠢӮଆൔ,෮Ⴕࡎᆴ৽֥ഈ2011(11):24.ᇏ༯Ⴓሱ࠭ᅧ。ᆃ၂োၛݚغູׅࠢٓ,[3]ShihW,ChienCF,ShihC,:meeting϶ุ֝ြ֥IDMӌ္൞ᆃ၂ো。ၹሧჷႵcustomerneedsatTaiwanSemiconductorManufacturingCoཋ,ૌေ৫ቓ֞ڛༀᇅᄯࢠ҂ಸၞ,ఃିิശ[R].Boston:HarvardBusinessSchool,Case9-610-003,֥ڸࡆࡎᆴ္ཌྷؓႵཋ。ၛ϶ุ֝ြູ২,ᄀটᄀ2009.[4]ࡥᨃڶ,ݒಥը.۽ြ۽ӱᄝຖӁြࢸ֥ׅٓ၍ሇ[J].؟֥IDM܄ඳ఼ູ߄ࣩᆚႪ൝ࡼ҆ٳᇅᄯြༀຓ۽ြ۽ӱ,2011,14(4):1-10.Ї,ཟֻⅠौ。ChienChen-fu,’sindustry[J].IndustrialEngi-4 ࢲંneeringJournal,2011,14(4):1-10.Ч࣮ฐษਔࣖჵս۽Ӂြ֥ڛༀᇅᄯଽݤ[5]BirleyS,:aretheyanyࠣఃӁြਵ֝ӌഅ֥ܱӮۿၹ,ѩิԛࣖჵս۽differencefromnewmanufacturingventures[J].TheServiceြࣉೆڛༀᇅᄯ֥ࠎЧေაحຓေᆭࡏܒ。IndustriesJournal,1994,14(4):455-481.࣮ԢਔࡼSMS֥ڛༀࡎᆴ৽ᆜԛটຓ,္ࡼSMS[6]:justaserv-ބఃڛༀᇅᄯೂEMSӌഅࣉྛбࢠ,ѩၛັཱ౷icetomanufacturing[J].TheServiceIndustriesJournal,1996,16(3):389-400.ཌٚൔӯགྷԛ4ᇕ҂֥ڛༀᇅᄯ֥ྙ。[7]ќ,ਾ০.૫ཟᇅᄯఒြ֥ളӁྟڛༀࠣఃႏᄎଆൔ۴ऌၛഈ֥࣮აൌༀฐษ,ࠆ֤ၛ༯ࢲં。࣮[J].ೈ॓࿐,2007,21(3):)ࣖჵս۽൞ڛༀᇅᄯ֥၂ᇕׅٓ。࣮DanBin,LiuLi-hua,Researchonproducingserviceandop-ဒᆣਔࣖჵս۽ြᄝڛༀᇅᄯ3۱ࠎെ֥ଽݤ。erationmodeformanufacturingenterprise[J].SoftScience,ѩิԛ၂Ϯ֥ࡏܒটٳ༅ࣖჵս۽ြӮູڛༀᇅ2007,12(3):34-36.ᄯ֥ေ。[8][J].Har-2)๙ӈࣖჵս۽ؿᅚڛༀᇅᄯ֥ࣥ൞༵vardBusinessReview,1990(May-Jun):94-102.ڛༀളӁ,ఃՑ൞ളӁྟڛༀ,ቋުҌؿᅚܤग़[9]:aninterviewwithಆӱҕა。൞ഒඔ֥ห൹ᇅӱᆭ০ࠎӌഅఃؿPeterDruker[J].IndustryWeek,1998,247(17):9-20.
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