BGA and CSP Inspection
Int
rod
uc
ing
So
lvi
sio
n’s
FalconProFalconPro
FalconFalcon
Our Mission:
Provide Innovative Solutions in
Vision-based technology to Help
our Clients Strengthen their
Competitive Edge.
Needs for BGA Production Line
• Quality
• Cost
• Yield
• Lead Time
3 steps solution in Vision
Inspection: BGA FalconPro
• 1- FMI Technology
• 2- Automatic Handling
• 3- In-Process Inspection Capability
FMI Technology CSP 3D
mapping
PGA, 3-D Coplanarity
PGA, Missing Pin, 3D
FMI Technology
• Unique Patent Pending Technology
• Real 3-D mapping of the entire FOV
• High Level Deep data accuracy
• Adaptable to new Process environment
• BGA, CGA, CSP, Wafer bumps:
Extendable to sub-micron
FMI Technology for More Benefits
• Real 3-D mapping and combined 2D
measurements of the entire Field of View
- Substrate warpage, peel off,
- True 3-D Ball shape for BGA
and CSP package
- Grid-to-fiducial, chip out,
oxidizations…
All ball inspection, x-y detection and
warpage measurements.
Automatic Handling
• Multi-Function (Vision and Handling
Transfer Tool)
• Single Handling Station
• No need for manual handling
• No need to Separate Handling and
Stand-Alone Vision
In-Process inspection
Capability
• 100 % Quality Control
• Real Time Inspection for Process
Control
• Allow immediate action to Process Drift
• Reduce Waste & Reworks
• Yield Improvement
• Reduce Lead Time
Advantages
