日本SBU商情收集
SBU
RCC or PP + Laser Drill
photo via
thermo-setting resin + Laser drill
ALIVH
BBIT
Other
Laser Via Process
PTH & D/F
Core substrate
RCC laminating
Conformal mask formation & laser drill
Second layer RCC laminating
ALIVH process
Aramid cloth prepreg
Laser drilling
Surface pattern formation
Lay-up for Lamination
Conductive paste plugging
Lamination
Surface pattern formation
ALIVH Process
B2IT process
Printing conductive paste bump
Piercing prepreg with the bump
Surface pattern formation
Lamination & connection with copper
BBIT Process
Pattern Transfer Method
Plated Riser method
Dielectric Resin for build-up
Resin coated copper
Liquid type photo-dielectric
Film type photo dielectric
Liquid type thermally cured resin
Film type thermally cured resin
Prepreg
Thermally cured resin
Via Formation Process
Laser drilling
Photolithography
Mechanical drilling
Chemical etch
Circuit Formation Process
Subtraction method
Semi-additive method
Full-additive method
Full-additive method
pattern transfer mathod
Semi-additive plating
Coating or laminating thermally cured resin
drilling
Surface roughening and electroless Cu deposition
Plating resist pattern formation & pattern plating
Resist stripping and etch
1999 Market scale in Japan
2000 Market scale in Japan
Demand forecasting By Process
1999 SBU 各Maker行情
JMS ESTIMATION
2000 SBU 各Maker行情
JMS ESTIMATION
1999&2000日本HDI 行情
RCC Laser 需求增加九成,平均單價降7%, Photo via 需求減少四成平均單價降23%.
JMS ESTIMATION
Forecast Build-up Note PCs
JMS ESTIMATION
Forecast Cell Phone PCs
JMS ESTIMATION
Trend in the future(～2003)
JMS ESTIMATION
AMPS/D-AMPS Manufacturer
Mitsubishi
NEC
Motorola
Ericsson
PDC Manufacturer
Mitsubishi
Sony
Fujitsu
NEC
Panasonic
Ericsson
cdmaOne Manufacturer
Mitsubishi
Sony
Fujitsu
NEC
Panasonic
Ericsson
